Microelectrode Studies of S-NDR Copper Electrodeposition: Potentiodynamic and Galvanodynamic Measurements and Simulations
نویسندگان
چکیده
منابع مشابه
postnatal studies of bats (pipistrellus kuhlii and miniopterus schreibersii) & histomorphology and histochemistry studies of organs and diseases of (neurergus microspilotus and n. kaiseri)
1. to determine whether difference in birth body mass influenced growth performance in pipistrellus kuhlii we studied a total of 12 captive-born neonates. bats were assigned to two body mass groups: light birth body mass (lbw: 0.89 ± 0.05, n=8) and heavy birth body mass (hbw: 1.35 ± 0.08, n=4). heavier body mass at birth was associated with rapid postnatal growth (body mass and forearm length) ...
Multiscale simulations of copper electrodeposition onto a resistive substrate
During the initial stages of copper electrodeposition onto a thin seed layer, a nonuniform potential distribution arises, resulting in local variations in growth rate and deposit morphology. Early stages of morphology evolution during copper electrodeposition are of practical importance but have not been well studied. Here, a new multiscale approach is developed for numerical simulation of the ...
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abstract: mineral scaling in oil and gas production equipment is one of the most important problem that occurs while water injection and it has been recognized to be a major operational problem. the incompatibility between injected and formation waters may result in inorganic scale precipitation in the equipment and reservoir and then reduction of oil production rate and water injection rate. ...
Coupled Mesoscale—Continuum Simulations of Copper Electrodeposition in a Trench
Copper electrodeposition in submicron trenches involves phenomena that span many orders of magnitude in time and length scales. In the present work, two codes that simulate electrochemical phenomena on different time and length scales were externally linked. A Monte Carlo code simulated surface phenomena in order to resolve surface roughness evolution and trench in-fill. A 2-D finite difference...
متن کاملMPSA effects on copper electrodeposition investigated by molecular dynamics simulations.
In superconformal filling of copper-chip interconnects, organic additives are used to fill high-aspect-ratio trenches or vias from the bottom up. In this study we report on the development of intermolecular potentials and use molecular dynamics simulations to provide insight into the molecular function of an organic additive (3-mercaptopropanesulfonic acid or MPSA) important in superconformal e...
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2020
ISSN: 1945-7111
DOI: 10.1149/1945-7111/ab8e86